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Perhaps a word about feature size, chip size and
yield would be in order. We saw earlier that circuits arerepeated many times across a wafer's surface during the
photolithographic stage. Although great care is exercised intrying to prevent defects from becoming part of a wafer surface
(clean rooms, "bunny" suits, ultra-pure chemicals etc.) eachwafer that goes through a fab will end up with
some "killer" defects distributed across
the wafer surface
.
A wafer with defects
Six killed circuits
Lots more good ones
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