Senior Manufacturing Engineer - Wafer Process

Excelitas® is a leading provider of advanced, life-enriching technologies that make a difference, serving global market leaders in the life sciences, advanced industrial, next-generation semiconductor and avionics end markets.
Headquartered in Pittsburgh, PA, USA, Excelitas is an essential partner in the design, development and manufacture of advanced technologies, offering leading-edge innovation in sensing, detection, imaging, optics and specialty illumination for customers worldwide.

Excelitas is at the forefront of addressing many of the relevant megatrends impacting the world today, including precision medicine, industrial automation, artificial intelligence, and connected devices (IoT).

Our facility in Batam, Indonesia specializes in the production of lighting and detection product technologies including our Specialty Lamps for industrial and photonics applications, IPL Lamps and Trigger Coils, as well as Infra-Red Detectors (IRD), Sensor Modules and Pyro-electric Ceramic Wafers.
Operating since September 1994, this site is also responsible for manufacturing of our Thermopile Sensors (TPS), Thermopile modules (TPM), CCD Sensors and Printed Circuit Board Assemblies.

We are seeking a Senior Manufacturing Engineer who will be responsible for driving process performance and improvement for a designated product line.
This role ensures stable daily operations, leads yield-improvement initiatives, and supports technology introduction activities to enhance long‑term manufacturing capability.

Key responsibilities:

• Lead end‑to‑end manufacturing process performance for the assigned product line, ensuring stable operations, output consistency, and continuous improvement.
• Monitor key process indicators, analyze trends, and initiate improvement actions to enhance yield, reduce variation, and strengthen process robustness.
• Drive structured investigations for complex or recurring issues using engineering tools such as SPC, DOE, 8D, FMEA, and root‑cause analysis methodologies.
• Identify and implement optimization opportunities to improve process capability, cost efficiency, and long‑term manufacturability.
• Execute engineering qualifications for new equipment, materials, and process changes, ensuring thorough evaluation and successful integration into production.
• Prepare, update, and maintain process documentation including specifications, work instructions, FMEA, OCAP, and technical reports.
• Assess material behavior, process interactions, and performance impact using relevant analytical techniques and engineering data.
• Collaborate closely with Production, Equipment, Quality, and Development teams to support process enhancements, capability upgrades, and product performance improvements.
• Support development activities by contributing technical input to wafer process development initiatives and assisting with the introduction and industrialization of new technologies.
• Lead cross-functional discussions and drive sustainable corrective and preventive actions for process or quality issues.
• Provide technical guidance, coaching, and competency assessments for technicians and operators to ensure adherence to process requirements.
• Ensure compliance with applicable quality, environmental, health, and safety standards within the area of responsibility.

Requirements:

• Bachelor's or Master's degree in Physics, Physics Engineering, Materials Science, or Advanced Engineering Materials.
• Minimum 3-5 years of relevant experience in semiconductor wafer fabrication is preferred.
  Fresh Master's graduates with strong research or laboratory experience are also encouraged to apply.
• Hands-on experience in process engineering, yield improvement, and data analysis.
• Familiarity with SPC, DOE, FMEA, Lean Six Sigma, and structured problem‑solving methodologies.
• Experience collaborating with development or new product introduction teams is an advantage.
• Understanding of material analysis techniques, including physical (PSA-Micro, PSA-Nano, hardness), composition (EDS, X-ray, FTIR), structural and morphological (SEM, FE-SEM, 3D Optical Microscope), and thermal methods (TGA, DSC).
• Strong analytical thinking, problem‑solving capability, and ability to lead cross-functional investigations.
• Good communication skills with the ability to work effectively with production, quality, and development teams.
• Proactive, structured, and data-driven approach with strong ownership and follow-through.
• Fluent in English, both written and spoken.